Thermal characterization methodology for thin bond-line interfaces with high conductive materials-Reference-Cited by-同舟云学术

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Thermal characterization methodology for thin bond-line interfaces with high conductive materials

Published:2024-08 Issue: Volume:53 Page:102754
ISSN:2451-9049
Container-title:Thermal Science and Engineering Progress
language:en
Short-container-title:Thermal Science and Engineering Progress

Author:

Martin Henry A.^ORCID,Libon Sébastien^ORCID,Smits Edsger C.P.,Poelma René H.^ORCID,van Driel Willem D.^ORCID,Zhang GuoQi^ORCID

Publisher

Elsevier BV

Reference38 articles.

1. Thermal characterization of highly conductive die attach materials;Ras,2014

2. Characterization of die-attach thermal interface of high-power light-emitting diodes: An inverse approach;Kim;IEEE Trans. Compon. Packag. Manuf. Technol.,2015

3. Characterization of lead-free solder and sintered nano-silver die-attach layers using thermal impedance;Cao;IEEE Trans. Compon. Packag. Manuf. Technol.,2011

4. Two-dimensional mapping of interface thermal resistance by transient thermal measurement;Gao;IEEE Trans. Ind. Electron.,2021

5. Die-attach materials for high temperature applications in microelectronics packaging;Siow,2018

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