Design of Reference Junction Temperature Swing of Power Module for Thermal Management-Reference-Cited by-同舟云学术

Design of Reference Junction Temperature Swing of Power Module for Thermal Management

Published:2023-01 Issue:1 Volume:38 Page:1132-1143
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Zhang Jun¹^ORCID,Du Xiong²^ORCID,Qian Cheng²^ORCID,Ye Yuyun³^ORCID,Zhou Junjie²

Affiliation:

1. College of Energy and Electrical Engineering, Hohai University, Nanjing, China

2. State Key Laboratory of Power Transmission Equipment and System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing, China

3. Department of Electrical and Computer Engineering, University of Tulsa, Tulsa, OK, USA

Funder

National Science Foundation of China for Distinguished Young Scholars

National Natural Science Foundation of China

Fundamental Research Funds for Central Universities

Natural Science Foundation of Jiangsu Province

China Postdoctoral Science Foundation

Jiangsu Postdoctoral Research Funding Program

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/63/9911205/09866835.pdf?arnumber=9866835

Reference30 articles.

1. Reliability of Power Electronic Systems: An Industry Perspective

2. Discontinuous-Modulation-Based Active Thermal Control of Power Electronic Modules in Wind Farms

3. Modulation Strategies for Thermal Stress Control of CHB Inverters

4. Active Junction Temperature Control of IGBT Based on Adjusting the Turn-off Trajectory

5. Active thermal control of power electronic modules

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