Review on the Thermal Parameters Applications in the Reliability of Power Semiconductor Device
Author:
Affiliation:
1. School of Electrical and Power Engineering, Hohai University,Nanjing,China
2. School of Electrical Engineering, Chongqing University,Chongqing,China
3. Chongqing Electric Power Research Institute, State Grid,Chongqing,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10582916/10582978/10583571.pdf?arnumber=10583571
Reference38 articles.
1. A Comprehensive Overview of Power Converter Applied in High-Power Wind Turbine: Key Challenges and Potential Solutions
2. An Industry-Based Survey of Reliability in Power Electronic Converters
3. Toward Reliable Power Electronics: Challenges, Design Tools, and Opportunities
4. Separation of Wear-Out Failure Modes of IGBT Modules in Grid-Connected Inverter Systems
5. AC Power Cycling Test Setup and Condition Monitoring Tools for SiC-Based Traction Inverters
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