PowerSynth 2: Physical Design Automation for High-Density 3-D Multichip Power Modules
Author:
Affiliation:
1. Department of Computer Science and Computer Engineering, University of Arkansas, Fayetteville, AR, USA
2. Department of Electrical Engineering, University of Arkansas, Fayetteville, AR, USA
Funder
National Science Foundation
Army Research Laboratory
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
https://ieeexplore.ieee.org/ielam/63/10046183/9973372-aam.pdf
Reference34 articles.
1. An improved planar module automatic layout method for large number of dies
2. Chip Layout Optimization of SiC Power Modules Based on Multiobjective Electro-Thermal Design Strategy
3. A double-sided stack low-inductance wire-bondless SiC power module with a ceramic interposer;huang,2021
4. PowerSynth Design Automation Flow for Hierarchical and Heterogeneous 2.5-D Multichip Power Modules
5. PowerSynth: A Power Module Layout Generation Tool
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