Review of High-Temperature Power Electronics Converters
Author:
Affiliation:
1. Department of Electrical Engineering, Technical University of Denmark, Kongens Lyngby, Denmark
2. Hebei University of Technology, Tianjin, P.R.China
Funder
Innovationsfonden
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/63/9970583/09705145.pdf?arnumber=9705145
Reference103 articles.
1. 18 kW three phase inverter system using hermetically sealed SiC phase-leg power modules
2. High temperature 1200 V/10 A silicon carbide MOSFET;version 4 7,0
3. Wire bond metallurgy for high temperature electronics
4. Effects of Large-Temperature Cycling Range on Direct Bond Aluminum Substrate
5. Silicon Carbide Power Modules for High-Temperature Applications
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