PCB-on-DBC GaN Power Module Design With High-Density Integration and Double-Sided Cooling-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

PCB-on-DBC GaN Power Module Design With High-Density Integration and Double-Sided Cooling

Published:2024-01 Issue:1 Volume:39 Page:507-516
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Tian Xingyue¹^ORCID,Jia Niu¹^ORCID,DeVoto Douglas²^ORCID,Paret Paul²^ORCID,Bai Hua¹^ORCID,Tolbert Leon M.¹^ORCID,Cui Han¹^ORCID

Affiliation:

1. Department of Electrical and Computer Engineering, University of Tennessee, Knoxville, TN, USA

2. National Renewable Energy Laboratory, Golden, CO, USA

Funder

PowerAmerica Member Initiated Projects 3

U.S. DOE

National Renewable Energy Laboratory

U.S. Department of Energy

University of Tennessee, Knoxville

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

https://ieeexplore.ieee.org/ielam/63/10339150/10239540-aam.pdf

Reference36 articles.

1. Gallium Nitride Semiconductors in Power Electronics for Electric Vehicles: Advantages and Challenges

2. Wide bandgap semiconductor power devices for energy efficient systems

3. Power Semiconductor Devices for Smart Grid and Renewable Energy Systems

4. Review of Commercial GaN Power Devices and GaN-Based Converter Design Challenges

5. Ammonothermal growth of gallium nitride;Pimputkar,2012

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP