Lumped Thermal Coupling Model of Multichip Power Module Enabling Case Temperature as Reference Node
Author:
Affiliation:
1. Key Laboratory of Control of Power Transmission and Conversion, Ministry of Education, Shanghai Jiao Tong University, Shanghai, China
2. Sieyuan Electric Company, Ltd., Shanghai, China
Funder
National Natural Science Foundation of China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/63/9803836/09772309.pdf?arnumber=9772309
Reference20 articles.
1. Thermal Coupling Analysis in a Multichip Paralleled IGBT Module for a DFIG Wind Turbine Power Converter
2. A rational formulation of thermal circuit models for electrothermal simulation. I. Finite element method;hsu;IEEE Trans Circuits Syst I Fundam Theory Appl,1996
3. Transient electrothermal simulation of power semiconductor devices;du;IEEE Trans Power Electron,2010
4. A Lumped Thermal Model Including Thermal Coupling and Thermal Boundary Conditions for High-Power IGBT Modules
5. Monitoring 3-D Temperature Distributions and Device Losses in Power Electronic Modules
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