Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,General Engineering,Electronic, Optical and Magnetic Materials
Cited by
3 articles.
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1. Cleaning Processes For HIC's with Solder Paste;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1984-06
2. Surface Phenomena in Electronics Interconnection Technology-A Review;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1982-06
3. Recent advances in solder bond technology for microelectronic packaging;Thin Solid Films;1980-10