Evolution, challenge, and outlook of TSV, 3D IC integration and 3d silicon integration-Reference-Cited by-同舟云学术

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Evolution, challenge, and outlook of TSV, 3D IC integration and 3d silicon integration

Published:2011-10 Issue: Volume: Page:
ISSN:
Container-title:2011 International Symposium on Advanced Packaging Materials (APM)
language:
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Author:

Lau John H.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6095477/6105665/06105753.pdf?arnumber=6105753

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