Parametric Modeling of Coupled Stripline Coupler With Arbitrary Operating Frequency and Coupling Coefficient in Silicon-Based 3-D RF Integration-Reference-Cited by-同舟云学术

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Parametric Modeling of Coupled Stripline Coupler With Arbitrary Operating Frequency and Coupling Coefficient in Silicon-Based 3-D RF Integration

Published:2024-08 Issue:8 Volume:14 Page:1441-1453
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Li Chen-Chen¹^ORCID,Qiu Liang-Feng¹^ORCID,Wu Lin-Sheng¹^ORCID,Mao Jun-Fa²

Affiliation:

1. State Key Laboratory of Radio Frequency Heterogeneous Integration, Shanghai Jiao Tong University, Shanghai, China

2. State Key Laboratory of Radio Frequency Heterogeneous Integration, Shenzhen University, Shenzhen, Guangdong, China

Funder

Science and Technology Commission of Shanghai Municipality

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx8/5503870/10675732/10614625.pdf?arnumber=10614625

Reference30 articles.

1. Evolution, challenge, and outlook of TSV, 3D IC integration and 3d silicon integration

2. Enhancement of Silicon-Based Inductor Q-Factor Using Polymer Cavity

3. Miniaturized 6-Bit Phase-Change Capacitor Bank with Improved Self-Resonance Frequency and $Q$

4. Materials for Advanced Packaging

5. 3-D Hyperintegration and Packaging Technologies for Micro-Nano Systems

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