Temperature influence mechanism of micromechanical silicon oscillating accelerometer
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/6126165/6135001/06135118.pdf?arnumber=6135118
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Review on MEMS Silicon Resonant Accelerometers;Journal of Microelectromechanical Systems;2024-04
2. Optimal design of the stress-buffering structure in MEMS resonant accelerometer package;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
3. Analysis of the Thermally Induced Packaging Effects on the Frequency Drift of Micro-Electromechanical System Resonant Accelerometer;Micromachines;2023-08-03
4. Thermal Stress Resistance for the Structure of MEMS-Based Silicon Differential Resonant Accelerometer;IEEE Sensors Journal;2023-05-01
5. A 3 PPM/°C Temperature Coefficient of Scale Factor for a Silicon Resonant Accelerometer Based on Crystallographic Orientation Optimization;2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers);2021-06-20
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