Optimal design of the stress-buffering structure in MEMS resonant accelerometer package-Reference-Cited by-同舟云学术

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Optimal design of the stress-buffering structure in MEMS resonant accelerometer package

Published:2023-08-08 Issue: Volume:4 Page:1-5
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Xiaorui Bie¹,Xingyin Xiong¹,Zheng Wang²,Wuhao Yang¹,Zhitian Li¹,Xudong Zou¹

Affiliation:

1. Aerospace Information Research Institute of Chinese Academy of Sciences,State Key Laboratory of Transducer Technology,Beijing,China

2. Qi Lu Aerospace Information Research Institute,Shangdong Key Laboratory of Low-Altitude Airspace Surveillance Network Technology,Jinan,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10491990.pdf?arnumber=10491990

Reference10 articles.

1. High Quality Factor Resonant MEMS Accelerometer With Continuous Thermal Compensation

2. Temperature-drift characterization of a micromachined resonant accelerometer with a low-noise frequency readout

3. Frequency response analysis of a capacitive micro-beam resonator considering residual and axial stresses and temperature changes effects;Valilou;J. Solid Mech.,2012

4. Simulation Analysis on Thermal Drift of MEMS Sandwich Accelerometer

5. Package design of mems accelerometer-based on two-stage stress isolation;Ju;Nav. Pos. Tim.,2021

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