ILP-Based Communication Reduction for Heterogeneous 3D Network-on-Chips
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Publisher
IEEE
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http://xplorestaging.ieee.org/ielx7/6498211/6498515/06498599.pdf?arnumber=6498599
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A survey on mapping and scheduling techniques for 3D Network-on-chip;Journal of Systems Architecture;2024-02
2. Design Space Exploration with Deterministic Latency Guarantees for Crossbar MPSoC Architectures;ICC 2020 - 2020 IEEE International Conference on Communications (ICC);2020-06
3. Temperature-Aware Core Mapping for Heterogeneous 3D NoC Design Through Constraint Programming;2020 28th Euromicro International Conference on Parallel, Distributed and Network-Based Processing (PDP);2020-03
4. Impact of Electrostatic Coupling on Monolithic 3D-enabled Network on Chip;ACM Transactions on Design Automation of Electronic Systems;2019-11-14
5. A Self-Adaptive Mapping Approach for Network on Chip With Low Power Consumption;IEEE Access;2019
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