Affiliation:
1. Washington State University, Pullman, Washington
2. Duke University, Duke University, Durham, NC
Abstract
Monolithic-3D-integration (M3D) improves the performance and energy efficiency of 3D ICs over conventional through-silicon-vias-based counterparts. The smaller dimensions of monolithic inter-tier vias offer high-density integration, the flexibility of partitioning logic blocks across multiple tiers, and significantly reduced total wire-length enable high-performance and energy-efficiency. However, the performance of M3D ICs degrades due to the presence of electrostatic coupling when the inter-layer-dielectric thickness between two adjacent tiers is less than 50nm. In this work, we evaluate the performance of an M3D-enabled Network-on-chip (NoC) architecture in the presence of electrostatic coupling. Electrostatic coupling induces significant delay and energy overheads for the multi-tier NoC routers. This in turn results in considerable performance degradation if the NoC design methodology does not incorporate the effects of electrostatic coupling. We demonstrate that electrostatic coupling degrades the energy-delay-product of an M3D NoC by 18.1% averaged over eight different applications from SPLASH-2 and PARSEC benchmark suites. As a countermeasure, we advocate the adoption of electrostatic coupling-aware M3D NoC design methodology. Experimental results show that the coupling-aware M3D NoC reduces performance penalty by lowering the number of multi-tier routers significantly.
Publisher
Association for Computing Machinery (ACM)
Subject
Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Computer Science Applications
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. 3D integration of 2D electronics;Nature Reviews Electrical Engineering;2024-04-25
2. Three-dimensional integration of two-dimensional field-effect transistors;Nature;2024-01-10
3. An ILD Void Detection Method for Monolithic 3D ICs Based on Switched Capacitors;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2022
4. A General Hardware and Software Co-Design Framework for Energy-Efficient Edge AI;2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD);2021-11-01
5. HeM3D;ACM Transactions on Design Automation of Electronic Systems;2021-02