On-Chip EM Sensor Arrays for Reliability Monitoring of Integrated Circuits
Author:
Affiliation:
1. University of Cincinnati,Department of ECE,Cincinnati,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10365712/10365727/10366049.pdf?arnumber=10366049
Reference22 articles.
1. Design for reliability with the advanced integrated circuit (IC) technology: challenges and opportunities
2. Effect of NBTI/PBTI aging and process variations on write failures in MOSFET and FinFET flip-flops
3. Electromigration and its impact on physical design in future technologies
4. Low-Overhead In-Situ Aging Monitors Using a Reconfigurable FeFET for Trusted Hardware
5. Electromigration and IC Interconnects
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