Effects of package type, die size, material and interconnection on the junction-to-case thermal resistance of power MOSFET packages-Reference-Cited by-同舟云学术

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Effects of package type, die size, material and interconnection on the junction-to-case thermal resistance of power MOSFET packages

Published:2011-08 Issue: Volume: Page:
ISSN:
Container-title:2011 12th International Conference on Electronic Packaging Technology and High Density Packaging
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Author:

Yue Cong,Lu Jun,Zhang Xiaotian,Ho Yueh-Se

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6056740/6066691/06066900.pdf?arnumber=6066900

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mounting Considerations for Power Transistors used on AC-DC Converter for UPS Applications;2023 IEEE 8th Southern Power Electronics Conference and 17th Brazilian Power Electronics Conference (SPEC/COBEP);2023-11-26

2. A Guide for Accurate and Repeatable Measurement of the R_{TH, JC} of SiC Packages;2022 IEEE Energy Conversion Congress and Exposition (ECCE);2022-10-09

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