A conformal ruthenium electrode for MIM capacitors in Gbit DRAMs using the CVD technology based on oxygen-controlled surface reaction
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/6881/18528/00852786.pdf?arnumber=852786
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Novel Storage-Node Contacts with Stacked Point-Cusp Magnetron Sp-TiN Barrier for Metal–Insulator–Metal Ru/Ta2O5/Ru Capacitors in Gigabit Dynamic Random Access Memories;Japanese Journal of Applied Physics;2004-06-09
2. Development of MIM/Ta2O5capacitor process for 0.10-µm DRAM;Electronics and Communications in Japan (Part II: Electronics);2004-01-22
3. Effect of Solvent on MOCVD of Pb(Zr, Ti)O[sub 3] Films with Liquid-Delivery Source Supply Method;Journal of The Electrochemical Society;2004
4. Investigation of the Contact Resistance between Ti/TiN and Ru in Metal-1/Plate Contacts of Ruthenium Insulator Silicon Capacitor;Japanese Journal of Applied Physics;2003-04-30
5. Effects of an Added Iodine Source (C2H5I) on Ru Metal–Organic Chemical Vapor Deposition;Chemical Vapor Deposition;2003-03-17
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