Surface Stability and Surface Plasma Treatment of Different Cu Surfaces for Leadframe-to-Mold Adhesion Improvement
Author:
Affiliation:
1. Ampleon Philippines Inc.
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013252.pdf?arnumber=10013252
Reference8 articles.
1. Plasma Cleaning for Plastic BGA: A Study on Surface Cleanliness;lee;Wire Bondability and Adhesion,1997
2. Improving Mold Compound Adhesion to Ni/Pd/Au Pre-plated Lead Frames
3. The Effect of Strip Argon Plasma Cleaning onto the PPF and Ag-plated Cu Leadframe Surfaces;fernandez;EPTC conference,2019
4. Study of top paddle delamination on Cu leadframe;tee;15th IEEE EPTC,2013
5. Surface Characterization and Leadframe-to-Mold Adhesion Performance of Oxidation-Roughened Leadframes
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1. Improvement of S-Ratio Measurement Method for Single-In-Line Package Leadframe Roughness;2024 1st International Conference on Robotics, Engineering, Science, and Technology (RESTCON);2024-02-16
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