Improving Mold Compound Adhesion to Ni/Pd/Au Pre-plated Lead Frames
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/10951/34490/01645845.pdf?arnumber=1645845
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Surface Stability and Surface Plasma Treatment of Different Cu Surfaces for Leadframe-to-Mold Adhesion Improvement;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
2. Adhesion and Reliability Study of Different EMC and Pre-plated Leadframe Surface Combination for Au and Cu Wire Bonded Leadless Package;2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2022-10-26
3. Effect of Package Singulation Parameters on Dual Flat Non-leaded Package Delamination;2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2022-10-26
4. Surface Plasma and Mold Deflash Treatment of Plated and Non-Plated Cu Leadframe for Leadframe-to-Mold Adhesion Improvement;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07
5. Surface Characterization and Leadframe-to-Mold Adhesion Performance of Oxidation-Roughened Leadframes;2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC);2020-12-02
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