Performance Analysis and Impact of Manufacturing Tolerances of multi-layers package substrate for 5G mmWave Antenna in Package/Module (AiP/AiM)-Reference-Cited by-同舟云学术

Performance Analysis and Impact of Manufacturing Tolerances of multi-layers package substrate for 5G mmWave Antenna in Package/Module (AiP/AiM)

Published:2022-12-07 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
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Author:

Ho Cheng-Yu¹,Hsieh Sheng -Chi¹,Huang Hong-Sheng¹,Chu Chia-Ching¹,Wang Chen-Chao¹

Affiliation:

1. Corporate Research and Development, Advanced Semiconductor Engineering (ASE), Inc.,Electrical Laboratory, Corporation Design Division,Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013302.pdf?arnumber=10013302

Reference8 articles.

1. A 77 GHz automotive radar receiver in a wafer level package;wagner;IEEE MTT-S Int Microw Symp Dig,2012

2. Ultra-Wide Patch Antenna Array Design at 60 GHz Band for Remote Vital Sign Monitoring with Doppler Radar Principle

3. mmWave AiP Measurement Turnkey Solution in Millimeter-Wave Wireless Communication Applications

4. A 77GHz Antenna-in-Package with Low-Cost Solution for automotive radar application;ho;Proc 68th Electron Comp Technol Conf,0

5. Analysis and Optimization of a Multilayer Organic Substrate for mm Wave Antenna in Package/Module Application;huang;2021 16th International Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT),0

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2. Analysis of the influences of PCB process tolerances and assembly tolerances on 60 GHz radar sensor for Radar toolkit;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05