mmWave AiP Measurement Turnkey Solution in Millimeter-Wave Wireless Communication Applications

Author:

Hsieh Sheng-Chi,Chu Fu-Cheng,Ho Cheng-Yu,Chen Wei-Yang,Wang Chen-Chao

Publisher

IEEE

Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A Compact mmWave 1x4 Antenna Array Design with Shorted Parasitic Elements for 5G AiP Applications;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. A Dual-Band Dual-Polarized 2×2 Antenna Array with Beamforming for 5G AiP and mmWave Applications;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11

3. A Low-Cost Antenna-in-Package (AiP) for D-Band Application;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

4. Design of Dual-Band Antenna in Package with Steerable Beam for 5G mmWave Communication Systems;2023 International Conference on Electronics Packaging (ICEP);2023-04-19

5. Performance Analysis and Impact of Manufacturing Tolerances of multi-layers package substrate for 5G mmWave Antenna in Package/Module (AiP/AiM);2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

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