Wafer Level Fabrication of cMUT using Bonding and Interconnection Technique without TSV/TGV-Reference-Cited by-同舟云学术

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Wafer Level Fabrication of cMUT using Bonding and Interconnection Technique without TSV/TGV

Published:2022-12-07 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
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Author:

Aditi ¹,Agarwal Rishabh¹,Sharma Rishi¹,Maiolo Luca²,Minotti Antonio²,Maita Francesco²,Mukhiya Ravindra¹

Affiliation:

1. CSIR-Central Electronics Engineering Research Institute (CSIR-CEERI),Pilani,India

2. Institute for Microelectronics and Microsystems (IMM)-CNR,Rome,Italy

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013111.pdf?arnumber=10013111

Reference7 articles.

1. A comparison between conventional and collapse-mode capacitive micromachined ultrasonic transducers in 10-MHz 1-D arrays

2. Capacitive microfabricated ultrasonic transducer (CMUT) probes: imaging advantages over PZT probes;panda;3rd International Workshop on Micromachined Ultrasonic Transducers,2003

3. Fabrication of Capacitive Micromachined Ultrasonic Transducer Arrays With Isolation Trenches Using Anodic Wafer Bonding

4. Fabrication of capacitive micromachined ultrasonic transducers with through-glass-via interconnects

5. Fabrication process for CMUT arrays with polysilicon electrodes, nanometre precision cavity gaps and through-silicon vias

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design, modelling and FEM-based validation of composite membrane circular cMUT cell;Microsystem Technologies;2023-09-05

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