Fabrication process for CMUT arrays with polysilicon electrodes, nanometre precision cavity gaps and through-silicon vias-Reference-Cited by-同舟云学术

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Fabrication process for CMUT arrays with polysilicon electrodes, nanometre precision cavity gaps and through-silicon vias

Published:2012-06-22 Issue:7 Volume:22 Page:074009
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Due-Hansen J,Midtbø K,Poppe E,Summanwar A,Jensen G U,Breivik L,Wang D T,Schjølberg-Henriksen K

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. A surface micromachined electrostatic ultrasonic air transducer

2. Surface micromachined capacitive ultrasonic transducers

3. CMUT array modeling through free acoustic CMUT modes and analysis of the fluid CMUT interface through Fourier transform methods

4. Linear and nonlinear equivalent circuit modeling of CMUTs

5. Annular-ring CMUT arrays for forward-looking IVUS: transducer characterization and imaging

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1. Small blind-area, high-accuracy ultrasonic rangefinder using a broadband multi-frequency piezoelectric micromachined ultrasonic transducer array;Measurement Science and Technology;2023-09-13

2. Wafer Level Fabrication of cMUT using Bonding and Interconnection Technique without TSV/TGV;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

3. Extreme value analysis of the impact of the effective gap tolerance on the acoustic transmit and receive performance of reverse-CMUT arrays;2022 IEEE International Ultrasonics Symposium (IUS);2022-10-10

4. Assessing the Microfabrication-Related Variability of the Performance of CMUT Arrays;IEEE Open Journal of Ultrasonics, Ferroelectrics, and Frequency Control;2022

5. Intelligent magnetic manipulation for gastrointestinal ultrasound;Science Robotics;2019-06-26

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