Wire sweep phenomenon overview by Ishikawa diagram-Reference-Cited by-同舟云学术

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Wire sweep phenomenon overview by Ishikawa diagram

Published:2022-12-07 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
language:
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Author:

Leone Federico¹,Viviani Fulvio¹,Grech Elijah²,Villa Riccardo¹

Affiliation:

1. STMicroelectronics, Back-End Manufacturing & Technology,Agrate Brianza,MB,Italy,20864

2. Triq L-Industrija, Hal Kirkop - Malta

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013233.pdf?arnumber=10013233

Reference7 articles.

1. The Effect of Filler Shape, Type, and Size on the Properties of Encapsulation Molding Componenets;chao;Electronics,2021

2. Materials and Processes for Electronic Applications - Encapsulation Technologies for Electronic Applications;ardebili;Characterization of encapsulant properties,2019

3. A new moddel of Ishikawa diagram for quality assessment;luca;20th Innovative Manufacturing Engineering and Energy Conference,2016

4. Chemistry and Technology of Epoxy Resins

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Wire loop characterization for wire sweep reduction;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. Setup Time Reduction of an Automotive Parts Assembly Line Using Lean Tools and Quality Tools;Eng;2023-09-13

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