Reliability of Pb-Free Preplated Leadframe Under Atmosphere and Accelerated Aging Test-Reference-Cited by-同舟云学术

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Reliability of Pb-Free Preplated Leadframe Under Atmosphere and Accelerated Aging Test

Published:2006-03 Issue:1 Volume:6 Page:33-41
ISSN:1530-4388
Container-title:IEEE Transactions on Device and Materials Reliability
language:en
Short-container-title:IEEE Trans. Device Mater. Relib.

Author:

Park J.,Kim Y.-H.,Wang S.-W.,Lee S.-W.,Jeon H.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/7298/33920/01618652.pdf?arnumber=1618652

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Coordination ability determined transition metal ions substitution of Tb in Tb-Asp fluorescent nanocrystals and a facile ions-detection approach;Nanoscale;2018

2. Characterisation of corrosion products formed on copper exposed at indoor and outdoor sites with high H2S concentrations;Corrosion Engineering, Science and Technology;2013-09

3. Adhesion improvement of Epoxy Molding Compound – Pd Preplated leadframe interface using shaped nickel layers;Microelectronics Reliability;2012-01

4. Study on the Adhesion Between Epoxy Molding Compound and Nanocone-Arrayed Pd Preplated Leadframes;Journal of Electronic Materials;2007-09-19

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