Study on the Adhesion Between Epoxy Molding Compound and Nanocone-Arrayed Pd Preplated Leadframes-Reference-Cited by-同舟云学术

Study on the Adhesion Between Epoxy Molding Compound and Nanocone-Arrayed Pd Preplated Leadframes

Published:2007-09-19 Issue:12 Volume:36 Page:1594-1598
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Hang Tao,Ling Huiqin,Xiu Zhengji,Li Ming,Mao Dali

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-007-0292-4.pdf

Reference16 articles.

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2. A. Fujii, M. Andoh, I. Yamamoto, H. Ibuki, K. Uchida, A.␣Yoshizumi, Electronics Manufacturing Technology Symposium, 1998 (23rd IEEE/CPMT, IEEE Publisher 1998), pp. 478–491

3. J. Park, Y. Kim, S.W. Wang, S.W. Lee, H. Jeon (2006) IEEE Trans. Dev. Mater. Reliab. 6(1): 33

4. K. Cho, E.C. Cho, Adhes. Sci. Technol. 14(11), 1333 (2000)

5. D. Abbott, T. Ahsan, A. Gallo, and C. Bischof, Proceedings of IPCSMEM Council APEX 2001, LF2-1 ( Essex: APEX Publisher 2001), pp. 1–11

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