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In-Depth Electrical Analysis to Reveal the Failure Mechanisms With Nanoprobing

  • Published:2008-06 Issue:2 Volume:8 Page:387-393
  • ISSN:1530-4388
  • Container-title:IEEE Transactions on Device and Materials Reliability
  • language:
  • Short-container-title:IEEE Trans. Device Mater. Relib.

Author:

Toh S.L.,Tan P.K.,Goh Y.W.,Hendarto E.,Cai J.L.,Tan H.,Wang Q.F.,Deng Q.,Lam J.,Hsia L.C.,Mai Z.H.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials

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2. Reconfigurable Self-Destructing Pre-Amplifier Physical Unclonable Function;2023 IEEE 32nd Microelectronics Design & Test Symposium (MDTS);2023-05-08

3. Open circuit defect positioning method based on dynamic photon emission microscopy and schematic analysis for mixed signal IC on SOI;Journal of Physics D: Applied Physics;2022-07-13

4. Finding Invisible Cracks via Nano-Probing;2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2021-09-15

5. Transfer Learning-Based Artificial Intelligence-Integrated Physical Modeling to Enable Failure Analysis for 3 Nanometer and Smaller Silicon-Based CMOS Transistors;ACS Applied Nano Materials;2021-06-28
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