Effect of Surrounding Air on Board Level Drop Tests of Flexible Printed Circuit Boards-Reference-Cited by-同舟云学术

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Effect of Surrounding Air on Board Level Drop Tests of Flexible Printed Circuit Boards

Published:2007 Issue: Volume: Page:
ISSN:
Container-title:2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007
language:
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Author:

Arruda Luciano,Freitas Germano

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4201119/4201120/04201206.pdf?arnumber=4201206

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Effect of Freestream Flow Velocities on the Flexible Printed Circuit Board with Different BGA Package Arrangements;Arabian Journal for Science and Engineering;2017-03-15

2. Study on the fluid‐structure interaction of flexible printed circuit board motherboard in personal computer casings;Microelectronics International;2013-07-26

3. Using FEA Simulation and Experimental Models of Flexible Substrates to Assist the Technology of Miniaturization of Electronic Devices;Advanced Materials Research;2013-01

4. Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance;Microelectronics Reliability;2012-04

5. Development of spring unit to reduce drive space and thickness of IT application and its experimental verification;International Journal of Precision Engineering and Manufacturing;2012-02

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