1. Wu, J., Song, G., Yeh, C. P. and Wyatt, K., “Drop/Impact Simulation and Test validation in Motorola,” 5th International LS-DYNA Users Conference, pp. 1–10, 1998.
2. Goyal, S., Upasani, S. and Patel, D. M., “Improving impact tolerance of portable electronic products: Case study of cellular phones,” Experimental mechanics, Vol. 39, No. 1, pp. 43–52, 1999.
3. Lim, C. T., Teo, Y. M. and Shim, V. P. W., “Numerical Simulation of the Drop Impact Response of a Portable Electronic Product,” IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 3, pp. 478–485, 2002.
4. Kim, Y. J., Koo, J. C., Moon, S. I. and Kim, Y. J., “Simplified Impact Analysis Based on Equivalent Static Analysis for Impact Design of TFT-LCD Panels,” Key Engineering Materials, Vol. 270-273, pp. 114–119, 2004.
5. Kim, O. R., Kim, M. Y., Lee, S. H. and Kwon, C. O., “A study on Plastic injection molding for Warpage Characteristics Evaluation of Mobile phone cover,” Trans of KSTP, Vol. 15, No. 1, pp. 76–81, 2006.