Detailed investigation on the creep damage accumulation of lead-free solder joints under accelerated temperature cycling-Reference-Cited by-同舟云学术

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Detailed investigation on the creep damage accumulation of lead-free solder joints under accelerated temperature cycling

Published:2010-04 Issue: Volume: Page:
ISSN:
Container-title:2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Chan Y. S.,Lee S. W. Ricky

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5457934/5464502/05464516.pdf?arnumber=5464516

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A numerical and experimental investigation of influential factors for solder joint reliability of power LEDs for automotive applications;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25

2. An evaluation of dwell time and mean cyclic temperature parameters in the Engelmaier model;Microelectronics Reliability;2015-02

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