A numerical and experimental investigation of influential factors for solder joint reliability of power LEDs for automotive applications
Author:
Affiliation:
1. AMS OSRAM AG,Regensburg,Germany
2. Technische Universität,Chemnitz,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9758836/9758837/09758848.pdf?arnumber=9758848
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3. Effects of dwell time and ramp rate on lead-free solder joints in FCBGA packages;fan;Proc Electronic Components and Technology Conf,2005
4. Effect of geometry and temperature cycle on the reliability of WLCSP solder joints
5. Detailed investigation on the creep damage accumulation of lead-free solder joints under accelerated temperature cycling
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