Failure mechanism of TFT devices on flexible substrate by cyclic bending test
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7784516/7785035/07785049.pdf?arnumber=7785049
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Frequency Dependent Degradation and Failure of Flexible a-InGaZnO Thin-Film Transistors Under Dynamic Stretch Stress;IEEE Transactions on Device and Materials Reliability;2023-09
2. Ambient Dependent Degradation Behavior of Flexible Poly-Si TFTs Under Dynamic Stretch Stress;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24
3. Statistical Study of Degradation of Flexible Poly-Si TFTs Under Dynamic Bending Stress;IEEE Journal of the Electron Devices Society;2022
4. A Phase Offset Selective Mapping Technique for PAPR Reduction in MIMO-UFMC;2021 Fifth International Conference on I-SMAC (IoT in Social, Mobile, Analytics and Cloud) (I-SMAC);2021-11-11
5. Origin of Degradation of Flexible Poly-Si TFTs Under Dynamic Bending Stress;IEEE Electron Device Letters;2021-11
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