A Unified Full-Field Deformation Measurement Approach for Plates With Different Thickness-Reference-Cited by-同舟云学术

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A Unified Full-Field Deformation Measurement Approach for Plates With Different Thickness

Published:2024 Issue: Volume:73 Page:1-13
ISSN:0018-9456
Container-title:IEEE Transactions on Instrumentation and Measurement
language:
Short-container-title:IEEE Trans. Instrum. Meas.

Author:

Shang Chen¹^ORCID,Wang Kai¹^ORCID,Bao Hong²^ORCID,Wang Wei¹^ORCID

Affiliation:

1. School of Mechano-Electronic Engineering and the Key Laboratory of Electronic Equipment Structure Design of Ministry of Education, Xidian University, Xi’an, China

2. School of Mechano-Electronic Engineering and Hangzhou Research Institute, Xidian University, Xi’an, China

Funder

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/19/10367905/10388452.pdf?arnumber=10388452

Reference41 articles.

1. Structural Health Monitoring and Prognostic of Industrial Plants and Civil Structures: A Sensor to Cloud Architecture

2. A new multidisciplinary approach towards airplane health monitoring using cantilever airflow sensors

3. A Review on SHM Techniques and Current Challenges for Characteristic Investigation of Damage in Composite Material Components of Aviation Industry

4. Potential Benefit of Structural Health Monitoring System on Civil Jet Aircraft

5. Introduction to Monitoring of Bridge Infrastructure Using Soft Computing Techniques

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