Preliminary investigation into the use of silver seed layers in copper electroplating of waveguide parts
Author:
Affiliation:
1. University of Pretoria,Dept. EEC Engineering,Pretoria,South Africa
2. Dept. Chemistry University of Pretoria,Pretoria,South Africa
Funder
Experiment
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9899858/9899859/09899901.pdf?arnumber=9899901
Reference12 articles.
1. An Integrated Monobloc 3D Printed Front-end in Ku-band
2. Plating on acrylonitrile–butadiene–styrene (ABS) plastic: a review
3. SLA Printed K-Band Waveguide Components using Tollens Reaction Silver Plating;simonovic;IEEE Trans Components Packag Manuf Technol,2022
4. Ka-Band Characterization of Binder Jetting for 3-D Printing of Metallic Rectangular Waveguide Circuits and Antennas
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