Stresses in thin film metallization-Reference-Cited by-同舟云学术

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Stresses in thin film metallization

Published:1997-06 Issue:2 Volume:20 Page:241-250
ISSN:1070-9886
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. A

Author:

Hodge T.C.,Bidstrup-Allen S.A.,Kohl P.A.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx4/95/12836/00588580.pdf?arnumber=588580

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