Funder
Ministry of Science and Technology, Taiwan
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference16 articles.
1. D. Resnik, J. Kovač, D. Vrtačnik, U. Aljančič, M. Možek, A. Zalar, and S. Amon, Investigation of interface properties of Ti/Ni/Ag thin films on Si substrate. Vacuum 82, 162 (2007).
2. G. Bassiri, Diffusion effect of intermetallic layers on adhesion and mechanical properties of electrical contacts. Fundam. Nanotechnol.: From Synth. Self-Assembl. (2006).
3. C. Srivastava, and B.M. Mundotiya, Size and solid solubility in electrodeposited Ag-Ni nanoparticles. Mater. Sci. Forum 736, 21 (2013).
4. Y.F. Wang, H.Y. Chen, B. Zhang, W.B. Liu, X.J. Ma, and X.H. Du, Investigation of metal peeling failure of Ti/Ni/Ag Metal thin films on silicon wafers. Adv. Mat. Res. 915, 847 (2014).
5. S. Porobova, T.J. Markova, V. Klopotov, A. Klopotov, O. Loskutov, and V. Vlasov, AIP Conf. Proc. 1698, 030005 (2016).
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