Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
16 articles.
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1. Study of temperature distributions in wafer exposure process;Heat and Mass Transfer;2002-08-01
2. 3-D finite element simulation of wafer thermal distortion and stress fields in exposure process;International Journal of Heat and Mass Transfer;2002-01
3. Clamping Characteristics of Pin-type Vacuum Chuck (1st Report);Journal of the Japan Society for Precision Engineering;1998
4. Optical projection system for gigabit dynamic random access memories;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;1993-11
5. Wafer process-induced distortion study for x-ray technology;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;1991-11