Author:
Bobba Shashikanth,Chakraborty Ashutosh,Thomas Olivier,Batude Perrine,Ernst Thomas,Faynot Olivier,Pan David Z.,De Micheli Giovanni
Cited by
29 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Interconnect and Integration Technology;Emerging Computing: From Devices to Systems;2022-07-09
2. RS3DPlace: Monolithic 3D IC placement using Reinforcement Learning and Simulated Annealing;2022 IEEE International Symposium on Circuits and Systems (ISCAS);2022-05-28
3. Introduction to 3D Technologies;3D Interconnect Architectures for Heterogeneous Technologies;2022
4. Monolithic 3-D Integration;IEEE Micro;2019-11-01
5. Test and Design-for-Testability Solutions for Monolithic 3D Integrated Circuits;Proceedings of the 2019 on Great Lakes Symposium on VLSI;2019-05-13