Author:
Osmolovskyi Sergii,Knechtel Johann,Markov Igor L.,Lienig Jens
Cited by
15 articles.
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1. Chipletizer: Repartitioning SoCs for Cost-Effective Chiplet Integration;2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC);2024-01-22
2. Routability-Driven Orientation-Aware Analytical Placement for System in Package;2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD);2023-10-28
3. Floorplanning for Embedded Multi-Die Interconnect Bridge Packages;2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD);2023-10-28
4. Multilevel Fixed-Outline Component Placement and Graph-Based Ball Assignment for System in Package;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-09
5. Automated Design of Chiplets;Proceedings of the 2023 International Symposium on Physical Design;2023-03-26