System level simulation solutions for high-speed channels - Package and PCB interface-Reference-Cited by-同舟云学术

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System level simulation solutions for high-speed channels - Package and PCB interface

Published:2013-08 Issue: Volume: Page:
ISSN:
Container-title:2013 IEEE International Symposium on Electromagnetic Compatibility
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Author:

Zhang Jianmin,Scogna Antonio Ciccomancini,Vincent Tracey,Shi Hong,Liu Hui

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6657463/6670363/06670481.pdf?arnumber=6670481

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Impact of Discontinuity in the Ground on the Signal Integrity of 100G PAM4 Ethernet;2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC);2023-05-23

2. A temporal model in Electronic Health Record search;Knowledge-Based Systems;2017-06

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