Impact of Discontinuity in the Ground on the Signal Integrity of 100G PAM4 Ethernet
Author:
Affiliation:
1. Hardware Engineering Group,Achronix Semiconductor Corporation,Santa Clara,California,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10217221/10217352/10217671.pdf?arnumber=10217671
Reference6 articles.
1. IEEE Standard for Ethernet Amendment 4: Physical Layer Specifications and Management Parameters for 100 Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Based on 100 Gb/s Signaling;IEEE Std 802 3ck-2022 (Amendment to IEEE Std 802 3-2022 as amended by IEEE Std 802 3dd-2022 IEEE Std 802 3cs-2022 and IEEE Std 802 3db-2022),2022
2. System level simulation solutions for high-speed channels - Package and PCB interface
3. Differential Crosstalk Mitigation in the Pin Field Area of SerDes Channel With Trace Routing Guidance
4. Crosstalk associated with solder ball and/or cutout-hole on the power/ground planes/nets
5. Effective Segmentation approach of Package-to-PCB modeling using Full-Wave EM field Solver
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