MNSIM 2.0: A Behavior-Level Modeling Tool for Processing-In-Memory Architectures-Reference-Cited by-同舟云学术

MNSIM 2.0: A Behavior-Level Modeling Tool for Processing-In-Memory Architectures

Published:2023-11 Issue:11 Volume:42 Page:4112-4125
ISSN:0278-0070
Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
language:
Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Zhu Zhenhua¹,Sun Hanbo¹,Xie Tongxin¹,Zhu Yu¹,Dai Guohao²^ORCID,Xia Lixue³,Niu Dimin⁴,Chen Xiaoming⁵^ORCID,Hu Xiaobo Sharon⁶^ORCID,Cao Yu⁷^ORCID,Xie Yuan⁴,Yang Huazhong¹,Wang Yu¹^ORCID

Affiliation:

1. Department of Electronic Engineering, Tsinghua University, Beijing, China

2. Qing Yuan Research Institute, Shanghai Jiao Tong University, Shanghai, China

3. Department of Cloud Intelligence, Alibaba Group, Beijing, China

4. Computing Technology Laboratory, Alibaba DAMO Academy, Hangzhou, China

5. Institute of Computing Technology, Chinese Academy of Sciences, Beijing, China

6. Department of Computer Science and Engineering, University of Notre Dame, Notre Dame, IN, USA

7. School of Electrical, Computer, and Energy Engineering, Arizona State University, Tempe, USA

Funder

Beijing Innovation Center for Future Chips

Tsinghua–Meituan Joint Institute for Digital Life

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Link

http://xplorestaging.ieee.org/ielx7/43/10288105/10058114.pdf?arnumber=10058114

Reference37 articles.

1. Noise Injection Adaption

2. A 700 μW 1GS/s 4-bit folding-flash ADC in 65nm CMOS for wideband wireless communications

3. DL-RSIM

4. 27.3 Area-efficient 1GS/s 6b SAR ADC with charge-injection-cell-based DAC

5. CIM-SIM

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