Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
14 articles.
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1. Planar Asymmetric Fed Interdigital Coupling Antenna-in-Package Using FOWLP Process Operating at 60–90 GHz in Endfire Mode;IEEE Transactions on Microwave Theory and Techniques;2024-04
2. Asymmetrical De-Embedding Method for Millimeter-Wave On-Wafer Measurement;2023 IEEE 16th International Conference on Electronic Measurement & Instruments (ICEMI);2023-08-09
3. A Simple Method for De-embedding the Coaxial to Waveguide Transitions;2022 International Semiconductor Conference (CAS);2022-10-12
4. Influence of Solder on De-Embedded Capacitance;2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC);2022-09-01
5. A Simple Solder-Free Fixture for Surface Mounted Device Measurement;2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT);2022-08-12