A New Current Crowding Phenomenon for Flip-Chip-on-Leadframe (FCOL) Package and its Impact on Electromigration Reliability
Author:
Affiliation:
1. Incorporated,Texas Instruments,Dallas,TX,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9994795/9994852/09995226.pdf?arnumber=9995226
Reference6 articles.
1. Relieving the current crowding effect in flip-chip solder joints during current stressing
2. Electromigration—A brief survey and some recent results
3. Electromigration failure prediction and reliability evaluation of solder bumps for FCBGA package;zhang;Transp Engrg,2015
Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Minor Ag induced shear performance alternation in BGA structure Cu/SnBi/Cu solder joints under electric current stressing;Journal of Materials Research and Technology;2023-07
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