Thermal Analysis of DDR5 DIMM with Forced Air Cooling Method
Author:
Affiliation:
1. Korea Advanced Institute of Science and Technology (KAIST),Daejeon,Republic of Korea
2. SK hynix Inc.,Icheon,Republic of Korea
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9994795/9994852/09994998.pdf?arnumber=9994998
Reference5 articles.
1. A Novel Dynamic PI Simulation Methodology Including Non-linear PMIC Characteristics for DDR5 Module
2. Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module
3. Methodology on thermal prediction of high-power memory modules considering air velocity, chip size and power consumption
4. OpenCAPI Memory Interface Signal Integrity Study for High-Speed DDR5 Differential DIMM Channel with Standard Loss FR-4 Material and SNIA SFF-TA-1002 Connector
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