Author:
Cai Biao,Hejase Jose,Giesen Kyle,Tang Junyan,Connolly Brian,Kim KyuHyoun,Dreps Daniel,Fan Zhineng,Huang Rocky,Yi Luyun,Chen Qiaoli,Huang Yifan,Smith Stephen
Cited by
2 articles.
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1. Thermal Analysis of DDR5 DIMM with Forced Air Cooling Method;2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS);2022-12-12
2. RX Equalization for a High-Speed Channel based on Bayesian Active Learning using Dropout;2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2020-10