Die Stacking Is Happening-Reference-Cited by-同舟云学术

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Die Stacking Is Happening

Published:2018-01 Issue:1 Volume:38 Page:22-28
ISSN:0272-1732
Container-title:IEEE Micro
language:
Short-container-title:IEEE Micro

Author:

Hu Xing,Stow Dylan,Xie Yuan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

http://xplorestaging.ieee.org/ielx7/40/8301101/08301133.pdf?arnumber=8301133

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. MuchiSim: A Simulation Framework for Design Exploration of Multi-Chip Manycore Systems;2024 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS);2024-05-05

2. At the Locus of Performance: Quantifying the Effects of Copious 3D-Stacked Cache on HPC Workloads;ACM Transactions on Architecture and Code Optimization;2023-12-14

3. TREAD-M3D: Temperature-Aware DNN Accelerators for Monolithic 3-D Mobile Systems;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-12

4. 3D-IC のテスト技術;Journal of The Japan Institute of Electronics Packaging;2023-11-01

5. Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock;Electronics;2022-08-16

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