Author:
Jin-Tai Yan ,Zhi-Wei Chen ,Bo-Yi Chiang ,Yu-Min Lee
Cited by
3 articles.
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1. Redundant Via Insertion for MP-DSAL;Physical Design and Mask Synthesis for Directed Self-Assembly Lithography;2018
2. Redundant Via Insertion for DSAL;Physical Design and Mask Synthesis for Directed Self-Assembly Lithography;2018
3. Through-silicon-via insertion for performance optimization in three-dimensional integrated circuits;Microelectronics Journal;2012-02