Development of a Scalable AiP Module for mmWave 5G MIMO Applications Based on a Double Molded FOWLP Approach-Reference-Cited by-同舟云学术

Development of a Scalable AiP Module for mmWave 5G MIMO Applications Based on a Double Molded FOWLP Approach

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Braun Tanja¹,Le Thi Huyen¹,Rossi Marco¹,Ndip Ivan¹,Holck Ole¹,Becker Karl-Friedrich¹,Bottcher Mathias¹,Schiffer Michael¹,Aschenbrenner Rolf¹,Muller Friedrich²,Voitel Marcus²,Schneider-Ramelow Martin²,Wieland Marcel³,Goetze Christian³,Trewhella Jean⁴,Berger Daniel⁴

Affiliation:

1. Fraunhofer Institute for Reliability and Microintegration,Berlin,Germany

2. Technical University Berlin,Berlin,Germany

3. GLOBALFOUNDRIES Dresden, Module One LLC & Co. KG,Dresden,Germany

4. Globalfoundries U.S. Inc.,NY,USA

Funder

Federal Ministry for Economic Affairs and Energy (BMWi)

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501922.pdf?arnumber=9501922

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