Author:
Yang Junbo,Lai Yangyang,Pan Ke,Xu Jiefeng,Mikjaniec Travis,Cain Stephen,Park Seungbae
Cited by
16 articles.
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1. Adhesion Layer Influence on Thermomechanical Reliability of Electroplated Copper Through-Glass Via (TGV);2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Bond-line Thickness Prediction for Thermal Interface Material under Usage Conditions;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. In situ Optical Observations of Degradation of Thermal Greases with Thermal Cycling;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
4. Reflow Oven Zone Temperature Advisor using the AI-Driven Smart Recipe Generator;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
5. Investigation on Fatigue Life of Non-Symmetric Solder Joints in Chip Resistors;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05